3D conformal shielding tape
As electronic devices become smaller by the day, PCB designs are also becoming miniature, denser and more complex. In addition, with the increasing demand for wireless devices, electromagnetic interference and heat diffusion have become crucial factors affecting the work of components. The traditional solution is to attach thermal conductive materials and weld metal shielding covers on the IC, but this solution is too heavy and has a large space volume, which cannot make the device smaller. Therefore, the integration of electromagnetic interference and heat dissipation in a lightweight and thin design has become an important issue.
| Traditional Solution | |
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New Solution
| Advantages: | |
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• Replacing metal shielding can • Very lightweight • Extremely less space • Excellent shielding effectiveness • Superior thermal dissipation |
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| Wearables | Smart Flight | Virtual Device |
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