EMI Metal Foil Tape
Application
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Simulation characterization
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Typical Properties
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Product |
7230CF |
7630SCF |
7930SCF |
DPSA-5010CU |
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Carrier |
Copper Foil |
Copper Foil |
Copper Foil |
Copper Foil+ Nonwoven Fabric |
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Total Thickness |
0.03mm |
0.03mm |
0.03mm |
0.05mm |
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Vertical Resistance, 4x4mm |
≤0.2Ω |
≤0.1Ω |
≤0.05Ω |
≤0.05Ω |
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Resistance through Adhesive, 1x10mm |
≤1Ω |
≤0.5Ω |
≤0.1Ω |
≤0.1Ω |
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Adhesion |
≥8N |
≥12N |
≥10N |
≥12N |
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Shielding Effect, 1-6G |
≥60dB |
≥70dB |
≥80dB |
≥85dB |
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Typical Application |
EMI Grounding |
EMI Grounding & Shielding |
EMI grounding & SoC shielding |
SoC Shielding for extreme requirements |
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